The DS26LS32 and DS26LS32A are quad differential line receivers designed to meet the RS, RS and Federal. Standards and for balanced. DS26LS32 datasheet, DS26LS32 circuit, DS26LS32 data sheet: NSC – Quad Differential Line Receivers,alldatasheet, datasheet, Datasheet search site for. DS26LS32 datasheet, DS26LS32 circuit, DS26LS32 data sheet: TI1 – DS26LS32AC/DS26LS32C/DS26LS32M/DS26LS33M Quad Differential Line Receivers.

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TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Pulse generator for all pulses: No TI components are authorized for use in FDA Class III or similar life-critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use. TI has taken and continues to take reasonable steps to provide representative and accurate datahseet but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

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DS26LS32 PDF Datasheet浏览和下载

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Logic Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. They are not meant to imply that the device should be operated at these limits. TI is not responsible or liable for any such statements. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.


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DS26LS32 (NSC) PDF技术资料下载 DS26LS32 供应信息 IC Datasheet 数据表 (3/8 页)

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DS26LS32 데이터시트(PDF) – National Semiconductor (TI)

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Testing and other quality control techniques are used to the extent Datashewt deems necessary to support this warranty. Propagation Delay S1 and S2 of load circuit are closed except where shown. Derate cavity package 9. Products Applications Audio www. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.

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Except where mandated by applicable law, testing of all parameters of datashete component is not necessarily performed.